New CHIPS Report Describes Metrology Grand Challenges for the Semiconductor Sector

New CHIPS Report Describes Metrology Grand Challenges for the Semiconductor Sector

The CHIPS Research and Development (R&D) Office has released a document that will serve as guidance for researchers supported with CHIPS R&D Metrology Program resources to develop project plans, including research activities and outcomes, with overarching goals in line with the CHIPS Act. Metrology Gaps in the Semiconductor Ecosystem combines the results of more than two years of rigorous stakeholder engagement, market research, strategic planning, and organizational development activities completed by NIST to design a program positioned to strengthen the U.S. semiconductor industry through advanced measurement, standardization, modeling, and simulation.  


Data collected through stakeholder engagement and internal planning confirmed that industry, academia, and government organizations require more advanced metrology across all stages of the semiconductor design and manufacturing value chain, including basic and applied R&D in the laboratory, prototyping at scale, factory fabrication, and assembly, packaging, and performance verification. The processed described in Metrology Gaps in the Semiconductor Ecosystem resulted in a list of 10 focus areas to address the highest-priority metrology gaps affecting the U.S. microelectronics industry. 


The 10 focus areas for the CHIPS R&D Metrology Program fall into two categories: 


Automation, Virtualization, and Security: 



Advanced Metrology for Supply Chain Trust and Assurance 




Verification and Validation of Advanced Models 




Advanced Modeling for Next-Generation Manufacturing Processes 




Standards for Automation, Virtualization, and Security 




Interoperability Standards for Equipment and Software  



Metrology for Next-Generation Microelectronics: 



Metrology for Advanced Materials and Devices 




Metrology for Nanostructured Materials Characterization 




Advanced Measurement Services 




Advanced Metrology for 3D Structures and Devices 




Materials Characterization Metrology for Advanced Packaging 



As the CHIPS R&D Metrology Program begins to fund research projects, it will use Metrology Gaps in the Semic ..

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