The National Institute of Standards and Technology (NIST) has released a summary of public comments solicited to inform the design of, and requirements for, potential Manufacturing USA institute(s) that would strengthen the semiconductor and microelectronics innovation ecosystem in such areas as design, fabrication, advanced test, assembly, and packaging capabilities.
NIST issued a Request for Information in the Federal Register on October 13, 2022, that was open until December 12, 2022. The intent of the RFI was to inform the development and establishment of up to three new Manufacturing USA semiconductor institutes. Today’s report summarizes more than 90 responses, the majority from organizations in the semiconductor sector, in five areas:
1. Institute scope
While the responses did not indicate a clear consensus on what topics new Manufacturing USA institute(s) should address, they did agree that the activities of any new semiconductor-related institute(s) should be carefully coordinated with other CHIPS Research and Development entities, including the National Advanced Packaging Manufacturing Program, the National Semiconductor Technology Center, and the existing Manufacturing USA institutes related to semiconductors.
2. Institute structure and governance
Responders agreed that the existing Manufacturing USA institutes are a good model for a new institute(s) to emulate. The scale of the new institute(s) would need to be broadened to measurably impact the semiconductor manufacturing ecosystem due to the high costs of manufacturing such complex devices.
3. Strategies for driving co-investment and engagement
Responders agreed that the co-investment strategy for the new institute(s) should be structured to encourage participation from the full diversity of stakeholders in the semiconductor ecosystem. Many responders called for shared access to expensive equipment, fabrication facilities, and novel materials, but they did not agree on how to reach that goal.
