OpenFive announced the launch of a new Die-to-Die (D2D) interface IP portfolio to serve next-generation chiplet based designs for networking, HPC, and AI markets.
With recent advances in package technologies and the cost per area increase in newer nodes, it is advantageous to connect multiple dies, or chiplets, on a single package with silicon-based interposer or an organic substrate. To enable this heterogeneous integration for various markets, OpenFive Die-to-Die connectivity IP is a major enablement block.
OpenFive’s 1st Generation Die-to-Die IP is specifically designed to provide a very low-latency controller to work with SerDes based connectivity between two dies. OpenFive Die-to-Die IP is intended to enable SoC architects to connect chip logic to optimized XSR/VSR/SR based SerDes while embracing native customer-defined interfaces, or Arm AMBA AXI.
OpenFive’s die-to-die controller uniq ..
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