Psst! Hey kid! Want to reverse-engineer some iPhones? Well, did you know that modern iPhones use PCIe, and specifically, NVMe for their storage chips? And if so, have you ever wondered about sniffing those communications? Wonder no more, as this research team shows us how they tapped them with a flexible printed circuit (FPC) BGA interposer on an iPhone 6S, the first iPhone to use NVMe-based storage.
The research was done by [Mohamed Amine Khelif], [Jordane Lorandel], and [Olivier Romain], and it shows us all the nitty-gritty of getting at the NVMe chip — provided you’re comfortable with BGA soldering and perhaps got an X-ray machine handy to check for mistakes. As research progressed, they’ve successfully removed the memory chip dealing with underfill and BGA soldering nuances, and added an 1:1 interposer FR4 board for the first test, that proved to be successful. Then, they made an FPC interposer that also taps into the signal and data pins, soldered the flash chip on top of it, successfully booted the iPhone 6S, and scoped the data lines for us to see.
This is looking like the beginnings of a fun platform for iOS or iPhone hardware reverse-engineering, and we’re waiting for further results with bated breath! This team of researchers in particular is prolific, having already been poking at things like MITM attacks on I2C and iphone tapped using flexible
