Credit: A. Kim/NIST
BALTIMORE — Today, the Biden-Harris administration announced its vision to boost U.S. capabilities for advanced packaging, a key technology for manufacturing state-of-the-art semiconductors. In remarks at Morgan State University, Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio laid out how the U.S. will benefit from the Department of Commerce CHIPS for America program’s manufacturing incentives and research and development efforts. In particular, approximately $3 billion in funding for the National Advanced Packaging Manufacturing Program will be used to drive U.S. leadership in advanced packaging. An initial funding opportunity for this program is expected to be announced in early 2024. Supporting innovation and keeping the U.S. at the forefront of new research is a critical part of the president’s Investing in America agenda.
“Making substantial investments in domestic packaging capabilities and R&D is critical to creating a thriving semiconductor ecosystem in America. We need to make sure new leading-edge chip architectures can be invented in our research labs, designed for every end-use application, manufactured at scale and packaged with the most advanced technologies. This new vision for advanced packaging will enable us to implement President Biden’s Investing in America agenda and make our country a leader in leading-edge semiconductor manufacturing,” said Secretary of Commerce Gina Raimondo.
“Within a decade, we envision that America will both manufacture and package the world’s most sophisticated chips,” said NIST Director Laurie E. Locascio. “This means both onshoring a high-volume advanced packaging industry that is self ..
Support the originator by clicking the read the rest link below.
