Credit: A. Kim/NIST
Today, the U.S. Department of Commerce issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. The CHIPS for
America program anticipates approximately $300 million in funding innovation across multiple technologies ranging from semiconductor-based to glass and organics. This is the third NOFO released overall by CHIPS for America, and the first that is focused on R&D.
President Biden signed the bipartisan CHIPS and Science Act into law on August 9, 2022. The Department of Commerce is overseeing
$50 billion to revitalize the U.S. semiconductor industry and strengthen the country’s economic and national security. CHIPS for America R&D within the U.S. Department of Commerce is responsible for administering $11 billion to advance U.S. leadership in semiconductor R&D. CHIPS R&D is a critical part of President Biden’s agenda to support American innovation for decades to come.
Emerging applications like artificial intelligence, advanced telecommunications, biomedical devices, and autonomous vehicles require leap-ahead advances in microelectronics capabilities. Improving all aspects of system performance to support the breadth of new semiconductor applications will require advanced packaging. The path to advanced packaging starts with substrates, which are the foundations on which systems are built. More capable substrates open the door to innovation at every other level in the packaging process.
“CHIPS for America is delivering on its vision to make sure new leading-edge chip architectures can be invented in our research labs, designed for every end-use application, manufactured at scale, and packaged with the most advanced technologies. Within a decade, research and activities funded by this advanced packagin ..
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