Dead-bugging — what is that, you ask? The concept comes from the idea that a memory chip, once it’s flipped over so you can attach wires to it, looks a little like a dead bug on its back.
So why would we do this for the purposes of IoT hacking? The typical reason is if you want to extract the memory from the device, and you either don’t have a chip reader socket for that chip package type or your chip reader and socket pinouts don’t match the device.
I encounter this issue regularly with Ball Grid Array (BGA) memory devices. BGA devices don’t have legs like the chip shown above, but they do have small pads on the bottom, with small solder balls for attaching the device to a circuit board. The following BGA chip has 162 of these pads — here it is placed on a penny for size comparison.
Sometimes, I encounter memory chips and don’t have a socket for attaching it to my chip reader. Sourcing the correct socket could take months, often from China, and I need to extract the data today. Other times, it’s just not cost-effective to purchase one of these sockets for my lab because I don’t encounter that chip package type very often. However, I do encounter the chip package type shown above all the time on embedded Multi Chip Packages (eMCP), and I have a chip reader for that device type.
Unfortunately, further research on this flash memory chip revealed that it is a Multi-Chip Package (MCP), meaning it does not have a built-in embedded controller, so my chip readers can’t interact with it. Al ..
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